5 energy way, p.o. box 1019, west warwick, ri 02893 usa tel. 800-424-9850/401-823-5200 ?fax 401-823-8723 ?email info@advint corp.com ?internet http://www.advintcorp.com ball grid array (bga) sockets inch/(mm ) products shown covered by patents issued and/or pending. specifications subject to change without notice. page 5 features : ?a dvanced ? exclusive eutectic solder ball terminals offer superior smt processing. ? uses same footprint as bga device. ?p roven long-term performance in vigorous temperature cycling applications - solder ball terminal absorbs tce mismatch. ?c losed bottom socket terminal for 100% anti-wicking of solder. ? gold contacts allow gold/gold interconnections to male adapter pins. ? low insertion force socket with multi- fingered high reliability beryllium copper contacts. ? coplanarity consistently under .006 inch industry standard. ?i n-house tape and reel packaging available. ?s ee page 4 for how it works. te rminals and contacts: t erminals: brass - copper alloy (c36000) astm-b-16 contacts: beryllium copper - copper alloy (c17200), astm-b-194 plating: g - gold over nickel body material: m - molded high temp. glass filled thermoplastic (p.p.s.), u.l. rated 94v-o, -60?c to 260?c (-76?f to 500?f) f - fr-4 glass epoxy, u.l. rated 94v-o solder: 63sn/37pb, eutectic, 183?c (361.4?f) standard socket (s): ? mates with standard adapter (a) ? socket size same size as bga device body ?u se with smt adapter for lga and reworked bga device socketing bga sockets t erminals: how to order footprint dash# if applicable 1 m g s xxx -636 g g contact plating g - gold terminal plating g - gold terminal type body type m - molded pps (1.27 & 1.5mm pitch) f - fr-4 (0.75, 0.80 & 1.0mm pitch) model type s = standard socket sb = extraction slot (1.5, 1.27 and 1.0mm pitch only) sg = guide post socket (1.5 and 1.27mm pitch only) pitch b = .059/(1.5mm) g = .050/(1.27mm) h = .039/(1.0mm) j = .0315/(0.80mm) k = .0295/(0.75mm) number of positions see bga footprint section or web site extraction socket (sb): ?m ates with extraction slot adapter (ax) ? socket size equals bga body + .079/(2.0) ?p rotects valuable pcb during device/adapter extraction - tool never touches pcb ?a vailable in 1.0, 1.27 and 1.5mm pitch only guide post socket (sg): ?i ntegral molded corners allow accurate positioning of device/adapter assembly in blind-mating applications. ?m ates with extraction slot adapter (ax) ? socket size equals bga body + .276/(7.00) ?a vailable in 1.27 and 1.5mm pitch only 1.0mm pitch terminals type -716 solder ball type -717 thru-hole .024/(0.61) dia. .105 (2.67) .090 (2.29) .015 dia. (0.38) .105 (2.67) .125 (3.18) .090 (2.29) patented type -636 solder ball type -673 thru-hole standard .018 dia. (0.46) .117 (2.97) .128 (3.25) patented .030 dia. (0.76) .117 (2.97) .095 (2.41) 1.27 & 1.5mm pitch terminals 0.80mm pitch terminals .011 dia. (0.28) .125 (3.18) .080 (2.03) type -731 thru-hole type -702 solder ball .020/(0.51) dia. .125 (3.18) patented 0.75mm pitch terminals type -758 solder ball .018/(0.46) dia. .125 (3.18) patented
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